Stress Induced Phenomena in Metallization : Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001 ... Phenomena Metallizat.)
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Book Description
Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
Book Info
Proceedings of the Sixth Intl Workshop on Stress Induced Phenomena in Metallization, held July 2001, in Ithaca, New York, USA. Contains research papers on these metallizations and on the reliability problems associated with them.
Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001 ... Phenomena Metallizat.),Shefford P. Baker,Matti A. Korhonen,Eduard Arzt,Paul S. Ho,American Institute of Physics,073540058X,Astronomy - General,Congresses,Defects,Electricity,Electrodiffusion,General,Integrated circuits,Physics,Science,Science/Mathematics,Semiconductor Physics,Thin film devices,Circuits & components,Computer chip manufacturing and quality control,General Theory of Computing,Stress & fracture,Technology / Optics,development of integrated circuits,microelectromechanical devices,research in reliability problems of electronic devices
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